Wafer tape frame. Film Frame Rings and Shippers

KRY1 en. Recommended Spare Parts Kit. A digital temperature controller ensures consistent workstage temperatures for repeatable mounting. Download Now. Built in peeler assembly for tape separation. Non-Contact assembly with the following features: Aluminum non-contact puck designed for one wafer.

 

Tape frames hold the wafer or other workpiece during dicing. Frame Size, Wafer Diameter, Type, Part Numbers. Frame size (mm), Material, Remarks.For example, four notched parts 4 AC are formed in the storage cylindrical portion 4 AB so that the notched parts 4 AC can grip the outer periphery of the wafer with tape frame 2.

 

Up to 6″ wafer capability standard. Accepts all film frames (specify type and size). Manual tape feed. Manual tape tensioner. Compatible with standard or.Our multiple film frame shippers provide a safe and effective way to ship and store up to 25 finished mm, mm, or mmwafers, or singulated die mounted to film frames.

 

Accepts all film frames (specify type and size). Manual tape feed. Manual tape tensioner. Compatible with standard or interleaved tape. Vacuum stage wafer hold-.A dicing tape T is stuck to the rear surface of a ring-shaped frame F, and a semiconductor wafer W is supported on the dicing tape to form a wafer with tape frame 2.

 

Wafer film frame used for maintaining the plastic tape during or after dicing operations, for wafer up to mm (12") - Standard material Stainless steel.The blade automatically retracts safely when not in use.

 

Our multiple film frame shippers provide a safe and effective way to ship and store up to 25 wafers or singulated die mounted to film frames.We are located in Moorpark, California, which is approximately 45 miles north of Los Angeles.

 

Dou Yee Enterprises (S) Pte Ltd is the premier total industrial solutions provider in the Asia Pacific region, serving with distinction the semiconductor.Each notched part 4 AC is formed with a predetermined width from the end portion of the storage cylindrical portion 4 AB toward the base portion 4 AA and arranged at equal intervals in a circumferential direction of the storage cylindrical portion 4 AB.

 

Model 300 Wafer/Film Frame Tape Applicator forum? A tray for storing a wafer with a tape frame in a storage container includes a ring-shaped frame, a dicing tape and a semiconductor wafer.Compatible With All Standard Film Frames Universal design allows any standard frame to be accurately positioned against locating pins.

 

The purpose of this Document is to standardize the specifications for mm wafer tape frames used between the dicing process and the die-bonding process.Next, a drop test was performed on the cardboard box including the storage container 4 and the two shock absorbers complying with ISO

 

Bubble Free Tape Application With vacuum holding the wafer in position, a captive roller travels from the front of the applicator along fixed guide rails over the wafer and film frame in a manner which eliminates any chance of entrapped pockets of air being formed between the tape and wafer which could create areas of low or no adhesion.

 

Additional aluminum non-contact puck.

 

A projecting portion is formed on the rear surface so that the projection portion is positioned outside the outer periphery of the semiconductor wafer of the wafer with the tape frame when the tray is positioned on the wafer with tape frame.

 

On the other hand, recently, the development of chip integration technologies 3DS-IC: three dimension stacking IC using Through Silicon Via TSV realized sophisticated, high speed and low power consumption chips and therefore it is considered as a future semiconductor technology driver.

 

Controls to remove back-up pressure when tape roller is off the wafer.

 

Compatible with standard or interleaved tape.

 

It becomes difficult for a semiconductor wafer W to swing in a downward direction by forming a substantially flat portion for mounting a wafer with tape frame 2 on the surface of the tray 1.

 

Eight trays 1 and seven wafers with tape frame 2 were stored in the storage container 4 in total.

 

Ideal for shipping "diced" or thinned GaAs or GaP wafers as well as storing or shipping wafers mounted to a film frame.

 

As synthetic resin, it is possible to use polypropylene series resin, polystyrene series resin, ABS series resin, polycarbonate series resin, polyacetal series resin, polyphenylene ester series resin, polyethernitrie series resin, polyphenylene sulfide series resin, polyphthale amide series resin, polyarylate series resin, polysulphone series resin, polyetersulphone series resin, polyeter imide series resin, liquid crystal polymer series resin, polyetheretherketone series resin, etc.

 

Film Frame Rings.

 

Next, a drop test was performed on the cardboard box including the storage container 4 and the two shock absorbers complying with ISO

 

KRY1 en.

 

Single thin plate storage container and shock-absorbing support members used therein.

 

As the added conductive fillers, it is possible to use carbon black, graphite carbon, graphite, carbon fiber, metal powder, metal fiber, metal oxide powder, metal coated inorganic fine powder, metal coated organic fine powder and metal coated fiber.

 

The semiconductor wafer W is produced by grinding the surface of the both sides, polishing the surface of at least one side to a mirror surface and forming a circuit pattern on the polished side.

 

Welcome to our website, our Sales and technical Support teams are at your disposal for all your questions and quote requests.

 

Contact Raymond Diaz.Forum Wafer tape frame

 

Contact Mickey Omori.

 

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Shippers are available for mm, mm and mm film frame applications.

 

The majority of the wafer remains untouched.

 

Additionally, it is easier to take out a tray 1 from a vacuum packed container because it is easy to take air into the inclined rear surface easy for vacuum cancellationand the resin spreading the filling efficiency of melted resin is improved during injection molding in comparison with a non-inclined flat tray.

 

TWA en.

 

The result is bubble-free tape mounting.

 

Vacuum stage wafer hold-down.

 

forum? Conventionally, a wafer with tape frame is formed by sticking a dicing tape on a ring-shaped frame and supporting a semiconductor wafer on the dicing tape, and the wafer with tape frame is stored in a storage container and transported to a dicing process and a die bonding process.

 

Contact Raymond Diaz.

 

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This option makes that process effortless and convenient.

 

Optional Non-Contact Platen When it is not desirable for the face of the wafer to come into contact with the platen, an optional non-contact platen is available.

 

USB2 en.